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2003 the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. mos integrated circuit pd168302 monolithic 2ch h-bridge driver data sheet document no. s16402ej1v0ds00 (1st edition) date published may 2003 ns cp (k) printed in japan description the pd168302 is monolithic dual h-bridge driver lsi which uses power mos fets in the output stages. by using the mos process, this driver has substantially improved the voltage loss of the output stage and power consumption as compared with conventional driver using bipolar transistors. as the package, a 24-pin plastic tssop is adopted to enable the creation of compact, slim application sets. it is provided with forward/reverse and brake functions and is ideal as a driver for dc motor and stepping motor. features ? 2ch h-bridge circuit employing power mos fets ? charge-pump circuit for low-voltage operation ? low output fet on resistance: 1.0 ? typ. 2.0 ? max. (sum of upper and lower side) ? output current: dc current 0.6 a/ch peak current 1.0 a/ch ? input logic frequency: 100 khz ? 5 v logic power supply: minimum operating supply voltage 4.0 v ? 0.9 to 3.6 v power supply for motor drive ? under voltage locked out circuit: shutdown internal circuit at v dd = 1.7 v typ. ? 24-pin plastic tssop (5.72 mm (225), 0.5 mm pitch) ordering information part number package pd168302ma-6a5 24-pin plastic tssop (5.72 mm (225))
data sheet s16402ej1v0ds 2 pd168302 1. block diagram oscillator circuit charge-pump circuit level shift circuit mos h-bridge circuit 1 mos h-bridge circuit 2 level shift circuit bgr circuit control circuit control circuit v dd v g v m note3 v m1 note3 v m2 note3 out1a out1b out2a out2b c 1h c 1l c 2h c 2l lgnd /stb note2 in1 note2 in2 note2 in3 note2 in4 note2 uvlo pgnd1 note1, 4 pgnd2 note1, 4 notes 1. the terminal which has more than one should connect not only one terminal but all terminals. 2. pull down resistance (50 to 200 k ? ) is connected to the input terminal. 3. it is recommended that v m terminal is connected to the terminal which either v m1 or v m2 is higher. 4. it is recommended that the voltage of pgnd1 and pgnd2 is not lower value than gnd.
data sheet s16402ej1v0ds 3 pd168302 2. pin connection c 1l c 1h v g v dd pgnd1 out1a v m1 out1b pgnd1 /stb in1 in2 c 2l c 2h v m lgnd pgnd2 out2a v m2 out2b pgnd2 n.c. in3 in4 1 24 2 3 4 5 6 7 8 9 10 11 12 23 22 21 20 19 18 17 16 15 14 13 3. pin functions package: 24-pin plastic tssop (5.72 mm (225), 0.5 mm pitch) pin no. pin name pin function 1c 1l capacitor connect pin for charge-pump circuit 2c 1h capacitor connect pin for charge-pump circuit 3v g gate voltage pin 4v dd power supply pin for logic circuit 5 pgnd1 power gnd pin 6 out1a output a pin for ch1 7v m1 power supply pin for power circuit 8 out1b output b pin for ch1 9 pgnd1 power gnd pin 10 /stb standby pin 11 in1 input logic 1 pin for ch1 12 in2 input logic 2 pin for ch1 13 in4 input logic 4 pin for ch2 14 in3 input logic 3 pin for ch2 15 n.c. (no connect) 16 pgnd2 power gnd pin 17 out2b output b pin for ch2 18 v m2 power supply pin for power circuit 19 out2a output a pin for ch2 20 pgnd2 power gnd pin 21 lgnd logic gnd pin 22 v m power supply pin for power circuit 23 c 2l capacitor connect pin for charge-pump circuit 24 c 2h capacitor connect pin for charge-pump circuit cautions 1. the terminal which has more than one should connect not only one terminal but terminals. 2. please recommend connecting unused pins to gnd.
data sheet s16402ej1v0ds 4 pd168302 4. application example out1a out1b out2a out2b pgnd2 pgnd1 lgnd controller /stb in1 in2 in3 uvlo oscillator circuit bgr circuit control circuit charge-pump circuit level shift circuit mos h-bridge circuit 1 mos h-bridge circuit 2 level shift circuit control circuit in4 c 1h c 1 c 2 c 3 c 1l c 2h c 2l v g v m v m1 v m2 v dd m 1 m 2 remark this circuit diagram is an example of connection, and is not a thing aiming at mass production.
data sheet s16402ej1v0ds 5 pd168302 5. function table input output in1 in2 /stb out1a out1b current direction l l h hi-z hi-z stop hlh h l out1a out1b (forward) lhh l h out1b out1a (reverse) hhh l l brake (regeneration mode) x x l hi-z hi-z all output stop mode (standby) input output in3 in4 /stb out2a out2b current direction l l h hi-z hi-z stop hlh h l out1a out1b (forward) lhh l h out1b out1a (reverse) hhh l l brake (regeneration mode) x x l hi-z hi-z all output stop mode (standby) remark h: high-level, l: low-level, hi-z: high impedance
data sheet s16402ej1v0ds 6 pd168302 6. h-bridge operation figure load forward a b v m v m v m v m gnd on on off off load reverse a b gnd gnd gnd on on off off load stop a b off off off off load brake a b on off on off
data sheet s16402ej1v0ds 7 pd168302 7. electrical specifications absolute maximum ratings (t a = 25 c. when mounted on a glass epoxy board (100 mm x 100 mm x 1 mm, 15% copper foil)) parameter symbol condition rating unit v dd logic ? 0.5 to +6.0 v power supply v m motor ? 0.5 to +4.0 v v g voltage v g ? 0.5 to +8.0 v input voltage v in ? 0.5 to v dd + 0.5 v output voltage v out motor 6.2 v dc output current i d(dc) dc 0.6 a/ch peak output current i d(pulse) pw < 10 ms, duty 20% 1.0 a/ch power consumption p t 0.7 w peak junction temperature t ch(max.) 150 c storage temperature t stg ? 55 to +150 c caution product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. that is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. recommended operating conditions (t a = 25c. when mounted on a glass epoxy board (100 mm x 100 mm x 1 mm, 15% copper foil)) parameter symbol condition min. typ. max. unit v dd logic 4.0 5.5 v power supply v m motor 0.9 3.6 v v g voltage note v g v m + 3.5 7.5 v input voltage v in 0v dd v dc output current i d(dc) dc ? 0.3 +0.3 a/ch peak output current i d(pulse) pw < 10 ms, duty 20% ? 0.7 +0.7 a/ch logic input frequency f in 100 khz capacitor for charge-pump c 1 to c 3 0.008 0.01 0.012 f operating temperature t a 070 c note when using charge-pump circuit, the voltage occurs internally at v g -pin (v m + 3.5 v (typ.)).
data sheet s16402ej1v0ds 8 pd168302 electrical characteristics (unless otherwise specified, t a = 25 c, v dd = 5 v, v m = 5.5 v) parameter symbol condition min. typ. max. unit v dd current at standby i dd (stb) /stb = l 1.0 a v dd current at operating i dd (act) 1.0 ma high-level input current i ih v in = v dd 100 a low-level input current i il v in = 0 v ? 1.0 a input pull-down resistance r ind 50 200 k ? high-level input voltage v ih 4.0 v v dd 5.5 v 0.7 x v dd v low-level input voltage v il 4.0 v v dd 5.5 v 0.3 x v dd v on resistance h-bridge r on i m = 0.3 a, sum of upper and lower 1.0 2.0 ? output leak current i m(off) per v m pin all control-pin = l (v m = recommenred range max.) 1.0 a low-voltage detected voltage v dds 1.7 2.5 v turn-on time at charge-pump t onc 1.0 ms output turn-on time t on 0.1 5.0 s output turn-off time t off c 1 = c 2 = c 3 = 0.01 f i m = 0.3 a, refer to figure 1, 2 0.1 5.0 s figure 1. charge-pump circuit operating wave t onc stb 50% 90% v g v m + 3.5 v (reference) figure 2. switching wave t on in 50% 50% 50% 50% t off i m
data sheet s16402ej1v0ds 9 pd168302 8. package drawing s 24-pin plastic tssop (5.72 mm (225)) note each lead centerline is located within 0.10 mm of its true position (t.p.) at maximum material condition. item millimeters a a' c d 6.65 0.10 6.5 0.1 0.1 0.05 f 0.5 (t.p.) g b 0.575 e 0.22 0.05 1.2 max. h 1.0 0.05 i 6.4 0.1 j 4.4 0.1 k 0.17 0.025 l 0.5 m 0.10 n 0.08 r 0.25 1.0 0.1 s 0.6 0.15 p24ma-50-6a5 p3 + 5 ? 3 24 13 1 12 m s n k f g l r s e p j dm c a b a' h i detail of lead end
data sheet s16402ej1v0ds 10 pd168302 9. recommended soldering conditions the pd168302 should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recommended below, contact an nec electronics sales representative. for technical information, see the following website. semiconductor device mount manual (http:// www.necel.com/pkg/en/m ount/index.html) pd168302ma-6a5: 24-pin plastic tssop (5.72 mm (225)) soldering method soldering conditions recommended condition symbol infrared reflow package peak temperature: 260c, time: 60 seconds max. (at 220c or higher), count: three times or less, exposure limit: none, flux: rosin flux with low chlorine (0.2 wt% or below) recommended ir60-00-3 caution do not use different soldering methods together (except for partial heating).
data sheet s16402ej1v0ds 11 pd168302 notes for cmos devices 1 precaution against esd for semiconductors note: strong electric field, when exposed to a mos device, can cause destruction of the gate oxide and ultimately degrade the device operation. steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. environmental control must be adequate. when it is dry, humidifier should be used. it is recommended to avoid using insulators that easily build static electricity. semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. all test and measurement tools including work bench and floor should be grounded. the operator should be grounded using wrist strap. semiconductor devices must not be touched with bare hands. similar precautions need to be taken for pw boards with semiconductor devices on it. 2 handling of unused input pins for cmos note: no connection for cmos device inputs can be cause of malfunction. if no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. cmos devices behave differently than bipolar or nmos devices. input levels of cmos devices must be fixed high or low by using a pull-up or pull-down circuitry. each unused pin should be connected to v dd or gnd with a resistor, if it is considered to have a possibility of being an output pin. all handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 status before initialization of mos devices note: power-on does not necessarily define initial status of mos device. production process of mos does not define the initial operation status of the device. immediately after the power source is turned on, the devices with reset function have not yet been initialized. hence, power-on does not guarantee out-pin levels, i/o settings or contents of registers. device is not initialized until the reset signal is received. reset operation must be executed immediately after power-on for devices having reset function.
pd168302 reference documents nec semiconductor device reliability/quality control system (c10983e) quality grades on nec semiconductor devices (c11531e) the information in this document is current as of may, 2003. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec electronics data sheets or data books, etc., for the most up-to-date specifications of nec electronics products. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec electronics. nec electronics assumes no responsibility for any errors that may appear in this document. nec electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec electronics products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec electronics or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. nec electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec electronics endeavors to enhance the quality, reliability and safety of nec electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. nec electronics products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to nec electronics products developed based on a customer- designated "quality assurance program" for a specific application. the recommended applications of an nec electronics product depend on its quality grade, as indicated below. customers must check the quality grade of each nec electronics product before using it in a particular application. the quality grade of nec electronics products is "standard" unless otherwise expressly specified in nec electronics data sheets or data books, etc. if customers wish to use nec electronics products in applications not intended by nec electronics, they must contact an nec electronics sales representative in advance to determine nec electronics' willingness to support a given application. (note) ? ? ? ? ? ? m8e 02. 11-1 (1) (2) "nec electronics" as used in this statement means nec electronics corporation and also includes its majority-owned subsidiaries. "nec electronics products" means any product developed or manufactured by or for nec electronics (as defined above). computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. "standard": "special": "specific":

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